Nvidia supplier SK Hynix to invest $3.87 billion in US chip packaging plant
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SK Hynix, the world's second-largest memory chip maker, will invest $3.87 billion to build an advanced packaging plant and research and development facility for AI products in Indiana. The new plant will include an advanced chip production line to mass-produce next-generation high bandwidth memory (HBM) chips, currently used in graphic processing units that train artificial intelligence systems. Mass production is planned to start in the second half of 2028. The facility will also house a packaging R&D line. SK Hynix pledged in 2022 to invest $15 billion in the semiconductor industry through R&D programs, materials, and the creation of an advanced packaging and testing facility in the US.

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https://www.investing.com/news/stock-market-news/nvidia-supplier-sk-hynix-to-invest-387-billion-in-us-chip-packaging-plant-3364283