NEO Semiconductor develops 3D DRAM with AI processing — new tech eyes to replace current HBM tech to solve data bus bottlenecks. NEO Semiconductor, focusing on 3D NAND flash memory and 3D DRAM, announced 3D X-AI chip technology to replace the HBMs currently used in AI GPU accelerators. This 3D DRAM has built-in AI processing that lets it process and generate outputs that do not require mathematical calculations. It reduces the data bus bottleneck problems when massive amounts of data are transferred between the memory and processor, increasing AI performance and efficiency.
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 NEO Semiconductor has developed a new technology called 3D X-AI chip, which aims to replace the current high bandwidth memory (HBM) chips and solve data bus bottlenecks in AI GPU accelerators . This technology combines 3D NAND flash memory and 3D DRAM and includes built-in AI processing capabilities. By transferring some of the AI processing from the GPU to the 3D DRAM