Huawei Mate 60 Pro Teardown Reveals Sanction-Breaching Components

A teardown video of the Huawei Mate 60 Pro has revealed the presence of two components that shouldn't be there: a 5G-capable, 7nm chipset and SK Hynix RAM chips.

The presence of these components is surprising because Huawei is currently under US sanctions that prohibit it from accessing certain technologies, including 5G chips and SK Hynix RAM.

It is unclear how Huawei managed to get these components, but some experts believe that it may have obtained them through third parties or through the black market.

The presence of these components in the Huawei Mate 60 Pro could have a number of implications. First, it could allow Huawei to continue developing and selling 5G smartphones, despite the US sanctions. Second, it could damage Huawei's reputation, as it could be seen as violating the sanctions. Third, it could lead to increased scrutiny of Huawei by US and international authorities.

Here are some more details about the two components in question:

* 7nm chipset:* The 7nm chipset is the most advanced type of chipset currently available. It is used in the latest flagship smartphones from companies like Apple, Samsung, and Qualcomm. The presence of a 7nm chipset in the Huawei Mate 60 Pro means that it will be able to compete with the latest smartphones from other companies in terms of performance and features.

*SK Hynix RAM chips:* SK Hynix is one of the world's leading manufacturers of RAM chips. The presence of SK Hynix RAM chips in the Huawei Mate 60 Pro means that it will have access to the latest and greatest RAM technology.

It remains to be seen what impact the presence of these components will have on Huawei and the Mate 60 Pro. However, it is clear that this is a significant development that could have a major impact on the smartphone industry.

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Video: https://youtu.be/o_fvf6Hblhs?si=inAUdoXfJNrVrrYa